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Csp3-Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes

Matthew Paeth, Sam B. Tyndall, Liang-Yu Chen, Jia-Cheng Hong, William P. Carson, Xingwu Liu, Xiaodong Sun, Jinjia Liu, Kundi Yang, Elizabeth M. Hale, David L. Tierney, Bin Liu, Zhi Cao*, Mu-Jeng Cheng, William A. Goddard III*, Wei Liu*

*CAS, Taiyuan, Shanxi 030001, P. R. China; Caltech, Pasadena, California 91125, United States; Miami University, Oxford, Ohio 45056, United States, Email:,,

M. Paeth, S. B. Tyndall, L.-Y. Chen, J.-C. Hong, W. P. Carson, X. Liu, X. Sun, J. Liu, K. Yang, E. M. Hale, D. L. Tierney, B. Liu, Z. Cao, M.-J. Cheng, W. A. Goddard III, W. Liu, J. Am. Chem. Soc., 2019, 141, 3153-3159.

DOI: 10.1021/jacs.8b12632 (free Supporting Information)

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Organocopper(III) complexes with well-defined structures can undergo reductive elimination for the formation of Csp3-Csp3 bonds. A general method for the synthesis of a series of [alkyl-CuIII-(CF3)3]− complexes followed by reductive elimination provides alkyl-CF3 products with good yields.

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ID: J48-Y2019